LCD / organic EL panel analysis

Does your company have requests like these?

We want to

analyze the cross-section structure at module, including the display panel and cover glass.
extract the pixels configured inside the panel and the schematic of the peripheral circuits
measure the driving signals and current consumption during panel operation
identify the manufacturer of the panel in a mounted set

Is your R&D engineer tasked to analyze LCD/organic EL panels? If so, …

Leave it to LTEC!

We can fulfill these requests with our refined investigative strength!!

This will allow you to dedicate the resources in your company to R&D activities.

Waveform Measurement of Driving Circuit

1. Waveform acquisition on a test pad

2. Waveform acquisition by partially exposing the display panel

3. OLED current consumption measurement

Since each pixel cathode connects to a common ground, the per pixel current measurement is possible. Our service begins with the creation of a disassembly plan, followed by disassembly, probe setup, and measurement.

Panel Static Characteristics Analysis

We evaluate the electrical characteristics of TFT. Probing is performed by using the terminals of the gate line, source line or pixel electrode, etc.

Panel Circuit Extraction

Panel built-in circuit

We extract the schematic for the peripheral circuits of the panel based on the layout pattern.

Driver IC

We extract the driver IC circuit schematic after delayering and the panel and tracing the connection around the driver IC.

Pixel circuit

We also extract the pixel circuit in an organic EL panel through observation of each panel layer.

Structural Analysis

Cross section analysis (module)

Touch panel, cover glass, etc. are laminated on the upper layers of the display panel of a smartphone. It is possible to conduct cross section analysis on these laminated structures.

Analysis is conducted using an optical microscope or SEM, and EDX analysis is also available.

Panel cross section analysis (SEM, TEM, EDX)

- We analyze the structures of TFT, contact hole, etc. and the thickness of each layer using TEM and SEM.
  
  We are also capable of EDX analysis in addition to TEM and SEM.