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2026.03.17

Server:Intel Xeon 6980P Server PCB Components Survey Report

Main PCB Package Removed of heat sink Product Overview Servers equipped with the Intel Xeon 69……

2026.03.05

HBM3: NVIDIA GH200_HBM3 Implementation Technology Analysis Report (Announcement) (Cross‑section, Materials and Plan‑view Observation)

GH200‑based board Hopper GPU Report Overview The NVIDIA GH200 Grace Hopper Superchip, introdu……

2026.02.09

Infineon CoolGaN Bidirectional switch IGLT65R055B2 GaNFET Structure Analysis Report

Package Die image Report Overview GaN devices are attracting significant attention as a key techn……

2026.02.03

AI Computer : Nvidia GB10 Grace Blackwell in NVIDIA DGX Spark Package and Main PCB detailed analysis

NVIDIA DGX Spark™ Main PCB Product outline The NVIDIA DGX Spark™ is one of the worl……

2026.02.03

SiC MOSFET (1200V): NAVITAS G3F17MT12FB2 SiCPAK Encapsulation Resin Analysis Report

Navitas：SiCPAK Navitas：G3F75MT12K Mitsubishi Electric：J1 Series(CT700CJA060) Analysis backgrou……

2026.02.03

Flyback Converter：Infineon Flyback SiP CoolSET ICE184LM Structure Analysis Report

Flyback SiP X-ray Source: ICE184LM datasheet Report Overview Infineon announced a new flyback ……

2026.01.06

SiC MOSFET(1200V)：LGE LGE3M18120Q Overview Analysis Report

Package SiC MOSFET die Report Overview China has expanded its presence to the point where, in 202……

2026.01.06

Si IGBT(1600V)：STMicroelectronics STGWA30IH160DF2 Overview analysis report

Package Internal Layout Report Overview IGBTs are capable of highly efficient switching operation……

2026.01.06

Edge AI Processor：Hailo Technologies’Hailo-8L’Overview Analysis Report

Package Die image Report Overview Edge AI Processor is a technology that performs AI processing d……

2026.01.06

GaN FET (650V): Renesas Electronics TP65H030G4PRS Package and GaN FET structure analysis report

Package GaN FET + Si MOSFET die Report Overview Renesas Electronics has launched and begun mass p……

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