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2026.07.06

SiC power Module (1200V)：StarPower MD22HFS120N6HY Module, SiC MOSFET Analysis Reports

Module SiC MOSFET Die Report Overview June 2024, Chinese company StarPower Semiconductor announce……

2026.07.06

GaN FET(1700V)：Power Integrations IMX2353F Structure Analysis Report

　　　　　　　Package　　　　 Package internal layout 　　GaN FET Die Report Overview November 2024, Power Inte……

2026.07.06

SiC MOSFET (1200V): StarPower Europe AG DM400S12TDRB Overview Analysis Report

Package SiC MOSFET Die Report Overview StarPower Semiconductor manufactures its own SiC dies and ……

2026.06.12

GaN(650V): GaN Transistors Manufacturing Cost Analysis Report

Report Overview 　GaN-based power devices are attracting significant attention in applications such as AC adapters, powe……

2026.05.27

AI Computer ： Nvidia GB10 Grace Blackwell in NVIDIA DGX Spark Package and Main PCB detailed analysis

NVIDIA DGX Spark™ Main PCB                 Product outline  The NVIDIA DGX Spark™ i……

2026.04.08

Integrated ECU(BCM FRONT,LEFT,RIGHT)：Xiaomi YU7 Teardown Report , Integrated ECU(BCM FRONT)：Xiaomi YU7 PCB Layout Report

Xiaomi YU7 Integrated ECU (BCM FRONT) Integrated ECU(BCM LEFT) Integrated ECU (BCM RIGHT) Ci……

2026.04.02

Infineon CoolGaN Bidirectional switch IGLT65R055B2 GaNFET Structure Analysis Report

Package Die image Report Overview GaN devices are attracting significant attention as a key techn……

2026.03.17

Server:Intel Xeon 6980P Server PCB Components Survey Report

Main PCB Package Removed of heat sink Product Overview Servers equipped with the Intel Xeon 69……

2026.03.05

HBM3: NVIDIA GH200_HBM3 Implementation Technology Analysis Report (Announcement) (Cross‑section, Materials and Plan‑view Observation)

GH200‑based board Hopper GPU Report Overview The NVIDIA GH200 Grace Hopper Superchip, introdu……

2026.02.09

Infineon CoolGaN Bidirectional switch IGLT65R055B2 GaNFET Structure Analysis Report

Package Die image Report Overview GaN devices are attracting significant attention as a key techn……

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