What’s New

2024.10.01

GaN HEMT Power Stage IC : ROHM BM3G007MUV-LB (EcoGaN) Gate driver IC Overview Analysis Report

Inside the package Gate driver chip overview Overview In order to achieve carbon neutrality and a……

2024.10.01

GaN FET with Integrated Driver: Texas Instruments LMG3522R030-Q1 Gate driver IC Overview Analysis Report

Inside the package (Bottom View) Gate driver IC chip overview Overview By the electrification of ……

2024.10.01

Sapphire Radis Xeon Gold 6434 Package analysis report

CPU & EMIB EDX spectrum Xeon Gold 6430 Coax Mil (X-ray) Abstract While Intel ……

2024.10.01

Fuji Electronics IGBT(1200V)_FGW75XS120C Structure analysis Report

Package appearance Internal layout Die photograph Abstract Fuji Electric has added a new low-l……

2024.10.01

SiC MOSFET(1200V):Wolfspeed (mounted on Lucid Motors Lucid Air) Power module EAB450M12XM3 Structure

Power module appearance Inside the power module SiC MOSFET die Report summary In September 202……

2024.10.01

Inverter:Hyundai MOBIS (Kia EV6 GT, Rear) PCB Circuit Analysis Report

Kia EV6 GT Cited: https://www.kia.com/uk/new-cars/ev6-gt/#text_441302445 Rear Inverter Overview R……

2024.10.01

SiC MOSFET(1200V):ON Semiconductor(equipped in Kia EV6 GT) Structure analysis Reports

Kia EV6 GT (From web information) (https://www.kia.com/uk/new-cars/ev6-gt/#text_441302445) Power c……

2024.10.01

SiC Diode Technology Benchmark Report (STMicro, Infineon, Onsemi)

Report Overview  First introduced commercially about 20 years ago, SiC Schottky Barrier Diodes (SBDs) have very low tur……

2024.10.01

Body ECU (Rear Unit):BYD Seal (2022) Teardown Report

BYD/Seal Body Controller (Rear Unit) Mounting PCB (Rear Unit) Cited:https://www.byd.com……

2024.10.01

Electronic Motorbike:Honda EM1 e: Teardown Report

Electronic motorbikes: Honda EM1 e: &Mobile Power Pack e: Motorbike Teardown report Battery pack Teardown repo……

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