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2024.11.06

Battery Cooling Blower:Nissan X-Trail Teardown Report

NISSAN X-TRAIL Source: https://www3.nissan.co.jp/vehicles/new/x-trail.html External appearance of c……

2024.11.06

SiC MOSFET (650V-1700V)：Epi (Drift+Buffer) Layer Survey Report

Overview  In SiC devices, in addition to determining the maximum operating and breakdown voltages, the structure and en……

2024.11.06

Three-phase gate driver IC：Texas Instruments DRV3245A Circuit Analysis Report

Package Package X-Ray Chip Overview General information  Gate drivers installed in electric ve……

2024.11.06

OBC+DCDC:TESLA CYBERTRUCK Teardown Report

CYBER TRUCK (from Web site) Overview of OBC+DCDC PCB (Top View) https://hypebeast.com/jp/2022/7……

2024.11.06

OBC:VMAX (Citroen AMI) PCB Circuit Analysis Report

Citroen AMI OBC Overview Main PCB Overview Cited from: https://store.citroen.co.uk/ami/my-ami-……

2024.11.06

OLED panel ：iPad Pro (11 inch) teardown report

(Display state) (illuminated state) (Element substrate: Anode layer) Product Pixels Repor……

2024.10.08

HestiaPower SiC MOSFET H2M120F080 Structure Analysis Report

Package appearance SiC MOSFET die (Top Metal) Report summary  The SiC market is rapidly growing d……

2024.10.08

Exynos W920 equipped with Galaxy Watch4 Galaxy Watch4FO-PLP (Fan Out Panel Level Package) analysis report

FO-PLP cross section Galaxy Watch4 PLP and WLP area comparison （Source：Samsung Electron……

2024.10.08

Structural analysis report of ROHM Si capacitor (BTD1RVFLT27N102)

Package Cross-section (CP-SEM) Introduction  The Si capacitor market is predicted to grow at a CA……

2024.10.08

Power Supply for PC Server:Lite-ON Technology DD-2162-2J (1600W) Circuit Analysis Report

DD-2162-2 J Overview DD-2162-2J Inside Label Overview 　This LITE-ON power supply unit for Fuji……

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