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2024.11.06

MLCC：High-density mounting PCB layout analysis report

Report summary MLCCs are used for noise reduction and power supply assistance, and the number of them being installed……

2024.11.06

iPhone 15 pro MAX installed X-ray analysis report

iPhone 15 pro MAX High frequency filter module X-ray image Abstract Approximately 20 RF Modules……

2024.11.06

Power Supply for Server:SuperMicro PWS-2K70A-1R Teardown Report

Appearance After remove the cover Overview This product is complain to 80 Plus Titanium power sup……

2024.11.06

Gate driver：Infineon 1EDI3020AS Priminaly IC Circuit Analysis Report

Package X-Ray Die image (Primary) Function block Product features Single channel isolated I……

2024.11.06

Toshiba DC brushless motor drive IC TPD4164F structural analysis report

Package Die image Report summary 　In March 2023, Toshiba announced the start of mass production o……

2024.11.06

SiC MOSFET（2000V）：Infineon IMYH200R100M1HXKSA1 Process analysis report

Package SiC MOSFET Report summary 　In January 2023, Infineon released a 2000V SiC MOSFET. The pro……

2024.11.06

SiC MOSFET(1200V)：Infineon AIMBG120R010M1 Structure Analysis Report

Package SiC MOSFET Report summary In May 2023, Infineon announced a new generation 1200V CoolSiC ……

2024.11.06

Electric Compressor:BYD SEAL PCB Circuit Analysis Report

BYD SEAL Cited: https://www.byd.com/eu/car/seal Compressor (Bird View) Compressor control board ……

2024.11.06

Apple M3 package board wiring layout (comparison with M1) report

Apple M3 processor Report summary In November 2023, MacBook Pro equipped with Apple M3 processor was……

2024.11.06

ICCU:Hyundai Mobis (Hyundai IONIQ5 EU Model) Teardown Report

Hyundai Mobility IONIQ5 Cited from：https://www.hyundai.com/jp/ioniq5 IONIQ5 ICCU Overview  Hyu……

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