semiconductor

Flyback Converter：Infineon Flyback SiP CoolSET ICE184LM Structure Analysis Report


Flyback SiP	X-ray	Source: ICE184LM datasheet

Report Overview

Infineon announced a new flyback SiP in April 2025. The CoolSET™ System‑in‑Package (SiP) integrates an 800 V P7 CoolMOS™, a zero‑voltage‑switching (ZVS) primary‑side controller, and a secondary‑side synchronous‑rectification (SR) controller with isolated communication via CT‑Link technology, all in a compact SMD package supporting power delivery up to 60 W.
The CoolSET™ SiP solution is a direct competitor to the market‑leading product from Power Integrations and employs innovative coreless‑transformer technology (CT‑Link) for secondary‑to‑primary signal transmission.
Note: Power Integrations uses high‑voltage GaN transistors, whereas Infineon uses silicon superjunction MOSFETs.

Product Features

Product type: ICE184LM Vdss=800V, RDS(ON)=0.84Ω
Released data: Apr. 2025

Datasheet：https://www.infineon.com/assets/row/public/documents/24/49/infineon-ice184lm-datasheet-en.pdf

Package: PG-DSO-27-1
Applications: Home appliances, auxiliary power supplies for communications equipment/servers, switching power supplies

Analysis result summary

Structure Analysis Report (53 pages)

CT-Link cross-section analysis and inductance estimation.
Estimation of process generations for primary and secondary control ICs.
CoolMOS™ P7 cell cross-section analysis and HV FET process generation estimation.
Compared to Power Integrations SiP (SC1933C), this product has approximately 1.2 times the area that can be used to mount power devices, and it is considered that even larger Si MOSFETs and CoolGaN can be mounted than Si MOSFET (P7) mounted on this product.

Please contact us regarding the Power Integrations SC1933C structure analysis report(19G-0008-2).