Sales report

semiconductor

SiC power Module (1200V):StarPower MD22HFS120N6HY Module, SiC MOSFET Analysis Reports

Module SiC MOSFET Die Report Overview June 2024, Chinese company StarPower Semiconductor announce……

semiconductor

GaN FET(1700V):Power Integrations IMX2353F Structure Analysis Report

       Package     Package internal layout   GaN FET Die Report Overview November 2024, Power Inte……

semiconductor

SiC MOSFET (1200V): StarPower Europe AG DM400S12TDRB Overview Analysis Report

Package SiC MOSFET Die Report Overview StarPower Semiconductor manufactures its own SiC dies and ……

semiconductor

GaN(650V): GaN Transistors Manufacturing Cost Analysis Report

Report Overview  GaN-based power devices are attracting significant attention in applications such as AC adapters, powe……

semiconductor

AI Computer : Nvidia GB10 Grace Blackwell in NVIDIA DGX Spark Package and Main PCB detailed analysis

NVIDIA DGX Spark™ Main PCB                 Product outline  The NVIDIA DGX Spark™ i……

semiconductor

Infineon CoolGaN Bidirectional switch IGLT65R055B2 GaNFET Structure Analysis Report

Package Die image Report Overview GaN devices are attracting significant attention as a key techn……

semiconductor

Server:Intel Xeon 6980P Server PCB Components Survey Report

Main PCB Package Removed of heat sink Product Overview Servers equipped with the Intel Xeon 69……

semiconductor

HBM3: NVIDIA GH200_HBM3 Implementation Technology Analysis Report (Announcement) (Cross‑section, Materials and Plan‑view Observation)

GH200‑based board Hopper GPU Report Overview The NVIDIA GH200 Grace Hopper Superchip, introdu……

semiconductor

Infineon CoolGaN Bidirectional switch IGLT65R055B2 GaNFET Structure Analysis Report

Package Die image Report Overview GaN devices are attracting significant attention as a key techn……

semiconductor

AI Computer : Nvidia GB10 Grace Blackwell in NVIDIA DGX Spark Package and Main PCB detailed analysis

NVIDIA DGX Spark™ Main PCB Product outline The NVIDIA DGX Spark™ is one of the worl……

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