semiconductor

GaN HEMT Power Stage IC : ROHM BM3G007MUV-LB (EcoGaN) Gate driver IC Overview Analysis Report

Inside the package Gate driver chip overview Overview In order to achieve carbon neutrality and a……

Package appearance Internal layout Die photograph Abstract Fuji Electric has added a new low-l……

Power module appearance Inside the power module SiC MOSFET die Report summary In September 202……

Package X-ray Chip Overview Report Summary In the automotive sector, the number of electronic ……

X-ray Top metal Overview Analog Devices launched Silent Switcher®3, the latest generation of lo……

Package Package X-Ray Chip Overview Overview EMI countermeasures is getting important due to ……

Package Photo Chip Photo(GaN HEMT) Chip Photo(Control IC) Overview In April 2022, STM……

Report summary The number of vehicles using SiC MOSFETs for their in-vehicle motor inverters is increasing, especially ……

Power module　(TG820FF08S3-S4A01) Report summary 　 This product is an automotive 750V 820A Si-IGB……

Package GaN HEMT die ESD protection diode die Report summary In recent years, GaN devices are ……