semiconductor

HestiaPower SiC MOSFET H2M120F080 Structure Analysis Report

Package appearance SiC MOSFET die (Top Metal) Report summary The SiC market is rapidly growing d……

Package appearance SiC MOSFET die Overview Coherent, Inc. in USA (formerly Ⅱ-Ⅵ) is a global ……

Apple M3 processor Report summary In November 2023, MacBook Pro equipped with Apple M3 proce……

　　 SiC power module SiC MOSFET die Report summary 　STMicroelectronics, one of the world’s leading ……

Package Package (inside) Die image (secondary side) Report summary 　Distributed power supply s……

Package appearance Package X-ray Secondary chip overview Overview The LEXUS RZ450e is ……

Inside the package Appearance of the high-side gate driver IC chip Overview In order to achieve c……

Hi-side Gate driver IC Function block (Analysis area) Product features Infineon has already rele……

Inside the package Gate driver chip overview Overview In order to achieve carbon neutrality and a……

Package appearance Internal layout Die photograph Abstract Fuji Electric has added a new low-l……