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2026.09.02

Chiplet：TSMC SoIC-mH Apple M5 Pro_MacBook Pro Cross section and Plane view Analysis Report

M5 Pro PKG Top view After removing the heatsink Overview The SoIC‑mH (Molding‑Horizontal) technolog……

2026.07.27

MCU(with Embedded MRAM)：Renesas Electronics RA8P1 Structure Analysis Report

Package MCU die image (Top Metal) Report Overview In recent years, industrial AI has been shiftin……

2026.07.27

3D NAND Flash Memory：YMTC (with TiPro9000) Structure Analysis Report

TiPro9000 PCB with YMTC 3D NAND Report Overview YMTC (Yangtze Memory Technologies Corp.) is China's ……

2026.07.27

3D NAND Flash Memory：YMTC (with HUAWEI Pura X) Structure Analysis Report

HUAWEI Pura X Mainboard 3D NAND Package Report Overview YMTC (Yangtze Memory Technologies Corp.) is……

2026.07.06

SiC power Module (1200V)：StarPower MD22HFS120N6HY Module, SiC MOSFET Analysis Reports

Module SiC MOSFET Die Report Overview June 2024, Chinese company StarPower Semiconductor announce……

2026.07.06

GaN FET(1700V)：Power Integrations IMX2353F Structure Analysis Report

　　　　　　　Package　　　　 Package internal layout 　　GaN FET Die Report Overview November 2024, Power Inte……

2026.07.06

SiC MOSFET (1200V): StarPower Europe AG DM400S12TDRB Overview Analysis Report

Package SiC MOSFET Die Report Overview StarPower Semiconductor manufactures its own SiC dies and ……

2026.06.12

GaN(650V): GaN Transistors Manufacturing Cost Analysis Report

Report Overview 　GaN-based power devices are attracting significant attention in applications such as AC adapters, powe……

2026.05.27

AI Computer ： Nvidia GB10 Grace Blackwell in NVIDIA DGX Spark Package and Main PCB detailed analysis

NVIDIA DGX Spark™ Main PCB                 Product outline  The NVIDIA DGX Spark™ i……

2026.04.08

Integrated ECU(BCM FRONT,LEFT,RIGHT)：Xiaomi YU7 Teardown Report , Integrated ECU(BCM FRONT)：Xiaomi YU7 PCB Layout Report

Xiaomi YU7 Integrated ECU (BCM FRONT) Integrated ECU(BCM LEFT) Integrated ECU (BCM RIGHT) Ci……

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