semiconductor

3D NAND Flash Memory：YMTC (with HUAWEI Pura X) Structure Analysis Report


HUAWEI Pura X Mainboard	3D NAND Package

Report Overview

YMTC (Yangtze Memory Technologies Corp.) is China’s largest 3D NAND flash manufacturer, backed by strong support from the Chinese government. Leveraging its proprietary “Xtacking” stacking technology, the company has rapidly expanded its market share, surging to become the fourth-largest player in the global market–trailing only Samsung, SK hynix, and Kioxia.
YMTC’s 3D NAND flash memory has seen widespread adoption across major Chinese smartphone brands, including Huawei, Xiaomi, Vivo, and OPPO.
LTEC released a structure analysis report on the YMTC 3D NAND flash memory found in the HUAWEI Pura X, which was launched in March 2025.

Product Features

Product type: YMTC 3D NAND Flash Memory in HUAWEI smartphone Pura X
Pura X Release Date : March 2025

Xtacking architecture
YMTC manufactures its proprietary peripheral circuitry (CMOS) and memory cells on separate wafers, which are then joined using hybrid bonding technology.

Analysis result summary

Structure Analysis Report (42 pages)
- Contains four flash memory dies (2-die stack × 2).
  　Equipped with an interface IC die.
- Cross-sectional analysis of the memory cell section was performed along the WL and BL directions to verify the structure, identify the Xtacking generation, determine the number of stacked memory gates, and estimate the process node based on the metal pitch.
- For the plan-view analysis, observations are conducted on the memory cell region as well as from the backside of the die.