semiconductor

MCU(with Embedded MRAM)：Renesas Electronics RA8P1 Structure Analysis Report


Package	MCU die image (Top Metal)

Report Overview

In recent years, industrial AI has been shifting from cloud AI, which performs inference in the cloud, to edge AI, which executes inference on edge devices.
July 2025, Renesas Electronics announced the ‘RA8P1’, a high-performance microcontroller featuring magnetoresistive random-access memory (MRAM) for edge AI applications.
This product is Renesas’ first 32-bit MCU equipped with a dedicated AI accelerator. It combines high-speed writing capabilities through the adoption of MRAM with the high processing power of an Arm Cortex-M85 core operating at 1 GHz.
LTEC released a structure analysis report focusing on the MRAM architecture, which represents one of the prominent features of the product.

Product Features

Product type: RA8P1 　32-bit MCU with dedicated AI accelerator
Released data: Jul. 2025

TSMC 22nm ULL process
Applications: Edge AI, Audio/Video processing, and Real-time analysis

Analysis result summary

Structure Analysis Report (46 pages)
- Cross-sectional TEM analysis and material analysis (EDX) of the MRAM memory cell area were conducted to analyze the details of the MTJ (Magnetic Tunnel Junction) elements.
- After delayering to the gate layer, imaging of the entire die was performed for layout verification